| 000 | 00553nam a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 151218s9999 xx 000 0 und d | ||
| 020 | _a9781441977588 | ||
| 040 |
_aCLIITBBS _cCLIITBBS _dCLIITBBS |
||
| 082 | 0 | 0 |
_a621.381046 _222 _bXIN/A |
| 100 |
_aXingcun, Colin Tong _9466 |
||
| 245 | 1 | 0 |
_aAdvanced materials for thermal management of electronic packaging / _cby Colin Tong Xingcun. |
| 260 |
_aNew York : _bSpringer, _c2011. |
||
| 300 | _axxi, 616 p. : 24 cm. | ||
| 504 | _aInclude Index | ||
| 650 |
_aElectronic packaging _9467 |
||
| 942 |
_2ddc _cTRB _08 |
||
| 999 |
_c6116 _d6116 |
||