Advanced materials for thermal management of electronic packaging / by Colin Tong Xingcun.
Material type: TextPublication details: New York : Springer, 2011.Description: xxi, 616 p. : 24 cmISBN:- 9781441977588
- 621.381046 22 XIN/A
Item type | Current library | Home library | Call number | Status | Date due | Barcode | Item holds | |
---|---|---|---|---|---|---|---|---|
Technical Reference Book | Central Library, IIT Bhubaneswar | Central Library, IIT Bhubaneswar | 621.381046 XIN/A (Browse shelf(Opens below)) | Available | 6898 |
Total holds: 0
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