TY  - BOOK
AU  - Xingcun, Colin Tong
TI  - Advanced materials for thermal management of electronic packaging / 
SN  - 9781441977588
U1  - 621.381046 22
PY  - 2011///
CY  - New York : 
PB  - Springer, 
KW  - Electronic packaging
N1  - Include Index
ER  -