Xingcun, Colin Tong <br/><br/>
Advanced materials for thermal management of electronic packaging /  
by Colin Tong Xingcun. 
 - New York :   Springer,   2011. 
 - xxi, 616 p. : 24 cm. 
<br/><br/>Include Index 
<br/><br/><label>ISBN: </label>9781441977588 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging
<br/><br/><label>Dewey Class. No.: </label>621.381046  / XIN/A