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Advanced materials for thermal management of electronic packaging /

Xingcun, Colin Tong

Advanced materials for thermal management of electronic packaging / by Colin Tong Xingcun. - New York : Springer, 2011. - xxi, 616 p. : 24 cm.

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ISBN: 9781441977588

Subjects--Topical Terms:
Electronic packaging

Dewey Class. No.: 621.381046 / XIN/A

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